Touch sensing device

ABSTRACT

A touch sensing device is provided. The device includes a substrate; a plurality of first electrodes formed on the substrate and arranged along a first direction without overlapping one another; a first insulating layer formed on the substrate and covering the plurality of first electrodes; and a plurality of second electrodes formed on the first insulating layer and arranged along a second direction without overlapping one another, wherein the first direction is vertical to the second direction.

CROSS REFERENCE TO RELATED APPLICATION

This is a divisional application of and claims the priority benefit ofU.S. application Ser. No. 12/690,908, filed on Jan. 20, 2010, nowallowed. The prior U.S. application Ser. No. 12/690,908 claims thepriority benefit of Taiwan application serial no. 98112461, filed onApr. 15, 2009. The entirety of each of the above-mentioned patentapplications is hereby incorporated by reference herein and made a partof this specification.

BACKGROUND

1. Technique Field

The disclosure relates to a touch sensing device.

2. Description of the Related Art

The conventional capacitive touch sensing display is formed byexternally bonding one or two touch sensing panels to a display panel.The substrate material of the touch sensing panels may be a patternedITO 0.7 mm or 0.5 mm glass, or a single layer patterned 175 um or 150 umPET/ITO substrate. While the glass substrate is formed at highertemperatures, beneficial for forming low resistance ITO electrode forfabrication of a stacked structure and large area manufacturing, thefabricated glass substrate is not flexible and has low capacitancesensitivity due to the thickness of the glass substrate, hinderingapplicability. Meanwhile, the PET/ITO substrate is formed at lowertemperatures, forming high resistance ITO electrodes, hinderingfabrication of a stacked structure and large area manufacturing.

U.S. Pat. No. 7,109,978 discloses a sense plane. The sense planeincludes a touch sensor array 22, wherein top, bottom, composite andcross-sectional views are respectively shown in FIG. 1A-1D. The touchsensor array 22 includes a substrate 24 having a first set of conductivetraces 26 disposed on a top surface 28 thereof and in a first directionto comprise row positions of the touch sensor array 22. A second set ofconductive traces 30 are disposed on a bottom surface 32 thereof and ina second direction orthogonal to the first direction to form the columnpositions of the touch sensor array 22. The first and second set ofconductive traces 26 and 30 alternately contact with the sense pads 34.An insulating layer 36 is disposed over the sense pads 34 on top surface28 to insulate a human finger or other object therefrom. The substratedisclosed in the U.S. Pat. No. 7,109,978 may be a Print Circuit Board(PCB) or a flexible PCB or any other useable circuit connectionstructure. The insulating layer 36 is a thin layer (i.e., Mylar).Therefore, in the manufacturing of the sense panel and the displaypanel, an assembly process for externally bonding is needed.

Thus, it provides a touch sensing device, formed with low resistance ITOelectrodes, having high capacitance sensitivity, flexibility and noexternal bonding assembly process.

SUMMARY

A detailed description is given in the following embodiments withreference to the accompanying drawings.

In one embodiment, the present invention provides a touch sensingdevice. The touch sensing device includes: a non-conductor soft or hardsubstrate, or a soft or hard compound substrate comprisinggas-water-proof material, anti-reflection optical material,electrode-adhesion-enhanced material, planarization material, orscrape-proof material; a plurality of first electrodes foil led on thesubstrate and arranged along a first direction without overlapping oneanother; a first insulating layer formed on the substrate and coveringthe plurality of first electrodes; and a plurality of second electrodesformed on the first insulating layer and arranged along a seconddirection without overlapping one another, wherein the first directionis orthogonal to the second direction. An isolating layer is formed onthe second electrodes to improve waterproofing, optical, planarizationor anti-interference performance.

In another embodiment, the present invention provides a touch sensingdevice. The touch sensing device includes: a non-conductor soft or hardsubstrate, or a soft or hard compound substrate comprisinggas-water-proof material, anti-reflection optical material,electrode-adhesion-enhanced material, planarization material, orscrape-proof material; a plurality of first electrodes and a pluralityof second electrodes formed on the substrate and arranged along a firstdirection and a second direction without overlapping one another; afirst insulating layer formed on the substrate and covering theplurality of first electrodes and second electrodes, and a plurality ofcavities are formed on the first insulating layer; a wire layercomprising a plurality of wires formed on the first insulating layer,and the first electrodes are connected by the plurality of wires,wherein the first direction is orthogonal to the second direction. Anisolating layer is formed on the wire layer to improve waterproofing,optical, planarization or anti-interference performance.

In another embodiment, the present invention provides a touch sensingdevice. The touch sensing device includes: a soft or hard substrate, ora soft or hard compound substrate comprising gas-water-proof material,anti-reflection optical material, electrode-adhesion-enhanced material,planarization material, or scrape-proof material; a plurality of firstelectrodes formed on the substrate and arranged along a first directionwithout overlapping one another; and a first insulating layer formed onthe substrate and covering the plurality of first electrodes; aplurality of second electrodes formed on the first insulating layer andarranged along a second direction without overlapping one another; apreventing layer formed on the first insulating layer and covering thesecond electrodes, wherein the first direction is orthogonal to thesecond direction. An isolating layer is formed under the isolating layerto improve waterproof, optical, planarization or anti-interferenceperformance.

In another embodiment, the present invention provides a structure of atouch sensing device. The touch sensing device includes: a soft or hardsubstrate, or a soft or hard compound substrate comprisinggas-water-proof material, anti-reflection optical material,electrode-adhesion-enhanced material, planarization material, orscrape-proof material; a wire layer comprising a plurality of wiresformed on the substrate; a first insulating layer formed on the wirelayer and a plurality of cavities are formed in the first insulatinglayer; a plurality of first electrodes and a plurality of secondelectrodes formed on the substrate and arranged along a first directionand a second direction without overlapping one another, and the firstelectrodes are connected by the plurality of wires via the plurality ofcavities; and a preventing layer formed on the first insulating layerand covering the plurality of first electrodes and the secondelectrodes, wherein the first direction is orthogonal to the seconddirection. An isolating layer is formed between the wire layer and thesubstrate to improve waterproofing, optical, planarization oranti-interference performance.

The above-mentioned touch sensitive structure provides display devices(e.g., Electrophoresis Display, LCD, OLED Display etc.) with a substratebasis.

BRIEF DESCRIPTION OF DRAWINGS

Embodiment can be more fully understood by reading the subsequentdetailed description and examples with references made to theaccompanying drawings, wherein:

FIG. 1A is a top view of a conventional touch sensing device;

FIG. 1B is a bottom view of a conventional touch sensing device;

FIG. 1C is a composite view of a conventional touch sensing device;

FIG. 1D is a cross-sectional view of a conventional touch sensingdevice;

FIG. 2 is a diagram showing a display device;

FIG. 3 is a diagram showing a touch sensing device of an embodiment;

FIG. 4 is a diagram showing a touch sensitive display device of anembodiment;

FIG. 5 is a diagram showing a touch sensing device of anotherembodiment;

FIG. 6 is a diagram showing a touch sensitive display device of anotherembodiment;

FIG. 7 is a diagram showing a touch sensing device of anotherembodiment;

FIG. 8 is a diagram showing a touch sensitive display device of anotherembodiment;

FIG. 9 is a diagram showing a touch sensing device of anotherembodiment;

FIG. 10 is a diagram showing a touch sensitive display device of anotherembodiment;

FIG. 11 is a diagram showing a touch sensing device of anotherembodiment;

FIG. 12 is a diagram showing a touch sensitive display device of anotherembodiment;

FIG. 13 is a diagram showing a touch sensing device of anotherembodiment;

FIG. 14 is a diagram showing a touch sensitive display device of anotherembodiment;

FIG. 15 is a diagram showing a touch sensing device of anotherembodiment;

FIG. 16 is a diagram showing a touch sensitive display device of anotherembodiment;

FIG. 17 is a diagram showing a touch sensing device of anotherembodiment;

FIG. 18 is a diagram showing a touch sensitive display device of anotherembodiment;

FIG. 19 is a diagram showing a touch sensing device of anotherembodiment;

FIG. 20 is a diagram showing a touch sensitive display device of anotherembodiment;

FIG. 21 is a diagram showing a touch sensing device of anotherembodiment;

FIG. 22 is a diagram showing a touch sensitive display device of anotherembodiment;

FIG. 23 is a diagram showing a touch sensing device of anotherembodiment;

FIG. 24 is a diagram showing a touch sensitive display device of anotherembodiment;

FIG. 25 is a diagram showing a touch sensing device of anotherembodiment;

FIG. 26 is a diagram showing a touch sensitive display device of anotherembodiment;

DETAILED DESCRIPTION

In the following detailed description, for purposes of explanation,numerous specific details are set forth in order to provide a thoroughunderstanding of the disclosed embodiments. It will be apparent,however, that one or more embodiments may be practiced without thesespecific details. In other instances, well-known structures and devicesare schematically shown in order to simplify the drawing.

FIG. 2 is a diagram showing a display device which includes a substratedevice 210, a display medium 220 and a bottom device 230. Generally, atouch sensing panel (not showed) is externally bonded to the substratedevice 210 and executed by conductors or fingers.

FIG. 3 is a diagram showing a touch sensing device of an embodiment ofthe invention. The touch sensing device 310 includes a substrate 311, aplurality of first electrodes 312, a first insulating layer 313 and aplurality of second electrodes 314.

The touch sensing device 310 includes the substrate 311 such as glass orplastics (PET-polyethylene terephthalate, PI, PES etc.) or functionalmaterial such as organic matter (e.g., SiO₂, SiNx, etc) or an inorganicmatter (Parylene) material stack which are used to increase hardness,water-tolerance, transmittance, and rub-proofing. The plurality of firstelectrodes 312 which are separated within an interval are formed on thesubstrate 311 and arranged along a first direction (e.g., x axial) in 2Dspace. The first electrodes 312 which are connected to one another byconductive wires (not showed) are used to sense total capacitancevariation according to the conductor 100 (or a finger) indirectlytouches the first electrodes 312 in the x axial. The first insulatinglayer 313 comprising material such as SiO2 or SiNx is formed on thesubstrate 311 and covers the plurality of first electrodes 312. Theplurality of second electrodes 314 such as transparent electrodes (e.g.,ITO, AZO, IZO etc.) are formed on the first insulating layer 313. Theplurality of second electrodes 314 are separated within an interval andarranged along a second direction (e.g., y axial) in 2D space. Thesecond electrodes 314 which are connected to one another by conductivewires (not showed) are used to sense total capacitance variationaccording to the conductor 100 (or a finger) indirectly touches thefirst electrodes 312 in the y axial. The touch sensing device 310 can bea substrate base of a substrate device 210 in a display device. A colorfilter or co-plane electrodes can be added. The touch sensing device 310also can be a substrate base of a bottom device 230 in the displaydevice. Film transistors or co-plane electrodes can be added. Thesequential processes are well known by those who are skilled in the art,so it's not detailed herein.

In another embodiment, as shown in FIG. 4, a touch sensing device 320includes a substrate 321, a plurality of first electrodes 322, a firstinsulating layer 323, a plurality of second electrodes 324 and anadhesive layer 325.

The difference between the foregoing touch sensing device 310 and thetouch sensing device 320 is the adhesive layer 325. The touch sensingdevice 320 can be externally bonded to the substrate device 210 in thedisplay device through the adhesive layer 325 which may be an OCA tape.

In another embodiment, as shown in FIG. 5, a touch sensing device 330includes a substrate 331, a plurality of first electrodes 332, a firstinsulating layer 333, a plurality of second electrodes 334 and anisolating layer 410. The difference between the foregoing touch sensingdevice 310 and the touch sensing device 330 is the isolating layer 410having an insulating layer 411 and a third electrode layer 412. Thesecond insulating layer 411 is formed on the second electrodes 334 andthe third electrode layer 412 is formed on the second insulating layer411. The second insulating layer 411 may be SiNx, SiO2, photo-resistor,plastics etc. The third electrode layer 412 may be a transparentconductor such as an ITO, IZO, AZO etc. The isolating layer 410 is usedto prevent interference from the display terminal. The touch sensingdevice 330 can be a substrate base of the substrate device 210 in adisplay. For an LCD as an example, a color filter and co-planarelectrode process would be performed on the substrate device 210. Thedisplay medium layer 220 would be liquid crystal and the bottom device230 would be a film transistor substrate.

The touch sensing device 340 as shown in FIG. 6 includes a substrate341, a plurality of first electrodes 342, a first insulating layer 343,a plurality of second electrodes 344, an adhesive layer 345 and anisolating layer 410 having a second insulating layer 411 and a thirdelectrode layer 412. The touch sensing device 340 can be bonded to thesubstrate device 210 through the adhesive layer 345.

In another embodiment as shown in FIG. 7, the touch sensing device 350has a compound isolating layer consisting of a plurality of insulatinglayers and a plurality of electrode layers for raisinginterference-proofing, water-proofing and optical performance. Forexample, the touch sensing device 350 has a compound isolating layer 420consisting of the second insulating layer 411, a plurality of thirdinsulating layers 421 and a plurality of third electrode layers 422 forraising interference-proofing, water-proofing and optical performance.The third electrode layers 422 and the third insulating layers 421 arestacked alternately on the second insulating layer 411. The touchsensing device 350 can be a substrate base of the substrate device 210in a display.

The touch sensing device 360 further includes an adhesive layer 365 asshown in FIG. 8. The touch sensing device 360 can be bonded to thesubstrate device 210 through the adhesive layer 365 as shown in FIG. 8to form a touch sensitive display device.

In another embodiment as shown in FIG. 9, the touch sensing device 510includes a substrate 511 such as glass or plastics (PET-polyethyleneterephthalate, PI, PES etc.) or functional material such as organicmatter (e.g., SiO₂, SiNx, etc) or an inorganic matter (Parylene)material stack which are used to increase hardness, water-tolerance,transmittance, and rub-proofing. A plurality of first electrodes 515 anda plurality of second 512 are formed on the substrate 511 and arrangedalong a first direction and a second direction without overlapping oneanother. The plurality of first electrodes and second electrodes arerespectively along the first direction x axial and the second directiony axial formed on the surface of the substrate 511 and the electrodesare separated within an interval. The first electrodes 515 and thesecond electrodes 512 (e.g., ITO, IZO, AZO etc) are formed on thesubstrate 511 with a sputter method. The second electrodes 512 areconnected by conductive wires (not showed) to sense total capacitancevariation along a y axial according to the conductor 100 (or a finger)indirectly touches the first electrodes 312. A patterned firstinsulating layer 513 comprising material such as SiO2, SiNx or otherorganic matter is manufactured by evaporation or other film processes tobe formed on the substrate 511 and cover the plurality of firstelectrodes 515 and second electrodes 512. Furthermore, a plurality ofcavities as passages are formed inside the first insulating layer 513. Awire layer 514 having a plurality of wires is formed by a film process,wherein the first electrodes 515 are connected by the wires through thecavities and the wire layer 514. Wire material may be transparentelectrodes (e.g., ITO, IZO, AZO etc.) or metal electrodes (e.g.,Ti—Al—Ti, Al, Cu, MoW etc.). The touch sensing device 510 can be asubstrate base of a substrate device 210 in a display device. A colorfilter or co-planer electrodes can be added. The touch sensing devicecan also be a substrate basis of a bottom device 230 in the displaydevice. Film transistors or co-planer electrodes can be added bymanufacturing processes. The sequential processes are well known bythose who are skilled in the art. So it's not detailed herein.

In another embodiment as shown in FIG. 10, the difference between theforegoing touch sensing device 510 and the touch sensing device 520 isthe adhesive layer 525. The touch sensing device 520 can be externallybonded to the substrate device 510 in the display device through theadhesive layer 525 which may be an OCA tape.

In another embodiment, as shown in FIG. 11, the difference between theforgoing touch sensing device 510 and the touch sensing device 530 isthe isolating layer 410 having a second insulating layer 411 and a thirdelectrode layer 412. The second insulating layer 411 is formed on thewire layer 534, and the third electrode layer 412 is formed on thesecond insulating layer 411. The second insulating layer 411 may beSiNx, SiO2, photo-resistor, plastics etc. The third electrode layer 412may be a transparent conductor such as ITO, IZO, AZO etc. The isolatinglayer 410 is used to prevent interference from the display terminal. Thetouch sensing device 530 can be a substrate base of the substrate device210 in the display. For an LCD as an example, a color filter andco-planar electrode process would be performed on the substrate device210. The display medium layer 220 would be liquid crystal. The bottomdevice 230 may be a film transistor substrate.

The touch sensing device 540 can be bonded to the substrate device 210as shown in FIG. 12. The touch sensing device 540 includes a substrate541, a plurality of first electrodes 545 and a plurality of secondelectrodes 542 and a first insulating layer. The plurality of firstelectrodes 545 and the plurality of second electrodes 542 arerespectively formed on the substrate 541 and arranged along a firstdirection x axial and a second direction y axial in 2D space. The firstand second electrodes are separated with an interval. A plurality ofcavities is formed inside the first insulting layer 543 as passages. Thetouch sensing device 530 can be bonded to the substrate device 210through the adhesive layer 545 to form a touch sensitive display device.

In another embodiment as shown in FIG. 13, the touch sensing device 550has a compound isolating layer 420 consisting of a second insulatinglayer 411, a plurality of third insulating layers 421 and a plurality ofthird electrode layers 422 for raising interference-proofing,water-proofing and optical performance. The touch sensing device 550 canbe a substrate base of the substrate device 210 in the display.

The touch sensing device 560 further includes an adhesive layer 565 asshown in FIG. 14. The touch sensing device 560 can be bonded to thesubstrate device 210 through the adhesive layer 565 as shown in FIG. 14.

In another embodiment as shown in FIG. 15. The touch sensing device 610includes a soft or a hard substrate 611 such as glass or plastics(PET-polyethylene terephthalate, PI, PES etc.) or functional materialsuch as organic matter (e.g., SiO₂, SiNx, etc) or an inorganic matter(Parylene) material stack which are used to increase hardness,water-tolerance, transmittance, and rub-proofing. The plurality of firstelectrodes 612 (e.g., ITO, AZO, IZO etc.) which are separated within aninterval are formed on the substrate 611 and arranged along a firstdirection (e.g., x axial). The first insulating layer 613 (e.g.,Parylene or SiNx, SiO₂) is formed on the substrate 611 with a filmprocess (e.g., evaporation or print coating) and covers the firstelectrodes 612. The plurality of second electrodes 614 which areseparated within an interval are formed on the first insulating layer613 and arranged along a second direction (i.e., y axial) in 2D space. Aprotecting layer 615 such as a functional film such as a scrape-prooflayer or anti-reflection layer or water-proof layer or gas-proof layeris coated on the first insulating layer 613 and covers the secondelectrodes 614. The touch sensing device 610 can be a substrate base ofa substrate device 210 in a display device. A color filter or co-planeelectrodes can be added. The touch sensing device also can be asubstrate base of a bottom device 230 in the display device. Filmtransistors or co-planer electrodes can be added. The sequentialprocesses are well known by those who are skilled in the art. So it'snot detailed herein.

In another embodiment as shown in FIG. 16, the difference between theforgoing touch sensing device 610 and the touch sensing device 620 isthe adhesive layer 626. The touch sensing device 620 can be externallybonded to the substrate device 210 in the display device through theadhesive layer 626 which may be an OCA tape.

In another embodiment as shown in FIG. 17, the difference between theforgoing touch sensing device 610 and the touch sensing device 630 isthe isolating layer 410 having a second insulating layer 411 and a thirdelectrode layer 412. The second insulating layer 411 such as organicinsulating layer or inorganic layer (e.g., photoresist, plastics,Parylene, SIO₂, SiNx etc.) is formed on the other side of the substrate631 by a coating process or an evaporation process. After that, thethird electrode layer 412 (e.g., ITO, IZO, AZO etc.) is formed on theinsulating layer 411. The touch sensing device 630 can be a substratebase of the substrate device 210 in the display. For an LCD as anexample, a color filter and co-planar electrode process would beperformed on the substrate device 210. The display medium layer 220would be liquid crystal. The bottom device 230 may be film transistorsubstrate.

The touch sensing device 640 further includes an adhesive layer 646 asshown in FIG. 18. The touch sensing device 640 can be bonded to thesubstrate device 210 through the adhesive layer 646 as shown in FIG. 18.

In another embodiment as shown in FIG. 19, the touch sensing device 650has a compound isolating layer 420 consisting of a second insulatinglayer 411, a plurality of third insulating layers 421 and a plurality ofthird electrode layers 422 for raising interference-proofing,water-proofing and optical performance. The touch sensing device 650 canbe a substrate base of the substrate device 210 in the display.

The touch sensing device 660 further includes an adhesive layer 666 asshown in FIG. 20. The touch sensing device 660 can be bonded to thesubstrate device 210 through the adhesive layer 666 as shown in FIG. 20to form a touch sensitive display device.

In another embodiment as shown in FIG. 21. The touch sensing device 710includes a soft or a hard substrate 711 such as glass or plastics(PET-polyethylene terephthalate, PI, PES etc.) or functional materialssuch as organic matter (e.g., SiO₂, SiNx, etc) or an inorganic matter(Parylene) material stack which are used to increase hardness,water-tolerance, transmittance, and rub-proofing. A wire layer 712having conductive wires manufactured from transparent conductive oxideelectrode (e.g., ITO, IZO, AZO etc.) or metal (e.g., Ti—Al—Ti, Al, MoWetc.) with sputter method is formed on the substrate 711. A firstinsulating layer 713 such as inorganic matter (e.g., SiNx, SiO₂, etc.)or organic matter (e.g., photoresist, Parylene, plastics etc.) is formedon the wire layer 712. A plurality of first electrodes 716 and secondelectrodes 714 (i.e., ITO, AZO, IGZO etc.) are formed on the firstinsulating layer 713 and arranged respectively along an x axial and a yaxial. Pluralities of cavities as passages are formed inside the firstinsulating layer 713 by an etching or laser process. The firstelectrodes are connected by the wires in the wire layer 712 through thefirst insulating layer 713 and the cavities. A protecting layer 715 suchas functional film such as a scrape-proof layer or anti-reflection layeror water-proof layer or gas-proof layer is coated on the firstinsulating layer 713, and covers the first electrodes 716 and the secondelectrodes 714. The touch sensing device 710 can be a substrate base ofa substrate device 210 in a display device. A color filter or co-planerelectrodes can be added. The touch sensing device can also be asubstrate base of a bottom device 230 in the display device. Filmtransistors or co-planer electrodes can be added by manufacturingprocesses. The sequential processes are well known by those who areskilled in the art. So it's not detailed herein.

In another embodiment as shown in FIG. 22, the difference between theforegoing touch sensing device 710 and the touch sensing device 720 isthe adhesive layer 726. The touch sensing device 720 can be externallybonded to the substrate device 210 in the display device through theadhesive layer 726 which may be an OCA tape.

In another embodiment, as shown in FIG. 23, the difference between theforgoing touch sensing device 710 and the touch sensing device 730 isthe isolating layer 410 having a second insulating layer 411 and a thirdelectrode layer 412. The third electrode layer 412 (e.g., ITO, IZO, AZOetc.) is firstly formed on the substrate 731. After that, the secondinsulating layer 411 such as organic insulating layer or inorganic layer(e.g., photoresist, plastics, Parylene, SIO₂, SiNx etc.) is formed onthe second insulating layer 411 by a coating process or an evaporationprocess before the wire layer 732 is formed. The touch sensing device730 can be a substrate base of the substrate device 210 in the display.For the LCD as an example, a color filter and co-planar electrodeprocess would be formed on the substrate device 210. The display mediumlayer 220 would be liquid crystal. The bottom device 230 may be filmtransistor substrate.

The touch sensing device 740 further includes an adhesive layer 746 asshown in FIG. 24. The touch sensing device 740 can be bonded to thesubstrate device 210 through the adhesive layer 746 as shown in FIG. 24.

In another embodiment as shown in FIG. 25, the touch sensing device 750has a compound isolating layer 420 consisting of a second insulatinglayer 411, a plurality of third insulating layers 421 and a plurality ofthird electrode layers 422 for raising interference-proofing,water-proofing and optical performance. The touch sense device 750 canbe a substrate base of the substrate device 210 in the display.

The touch sensing device 760 further includes an adhesive layer 766 asshown in FIG. 26. The touch sensing device 760 can be bonded to thesubstrate device 210 through the adhesive layer 766 as shown in FIG. 26to form a touch sensitive display device.

The display devices are manufactured by semiconductor process withoutexternally bonding process to increase product stability and decreasecost. The touch sensing devices can also be assembled to electronicproduct display surfaces by adhesion.

While the invention has been described by way of example and in terms ofthe preferred embodiments, it is to be understood that the invention isnot limited to the disclosed embodiments. To the contrary, it isintended to cover various modifications and similar arrangements (aswould be apparent to those skilled in the art). Therefore, the scope ofthe appended claims should be accorded the broadest interpretation so asto encompass all such modifications and similar arrangements.

What is claimed is:
 1. A touch sensing device, comprising: a substrate;a wire layer comprising a plurality of wires formed on the substrate; afirst insulating layer formed on the wire layer and a plurality ofcavities are formed on the first insulating layer; a plurality of firstelectrodes and a plurality of second electrodes formed on the substrateand arranged along a first direction and a second direction withoutoverlapping one another, and the first electrodes are connected by theplurality of wires via the plurality of cavities; a protecting layerformed on the first insulating layer and covering the plurality of firstelectrodes and second electrodes, wherein each of the first electrodeshas a first top surface facing away from the substrate, a first bottomsurface facing the substrate, and a first side surface connecting thefirst top surface and the first bottom surface, each of the secondelectrodes has a second top surface facing away from the substrate, asecond bottom surface facing the substrate, and a second side surfaceconnecting the second top surface and the second bottom surface, thefirst insulating layer covers the first bottom surface, the first sidesurface, the second bottom surface and the second side surface andexposes the first top surface and the second top surface, the protectinglayer covers the first top surface and the second top surface; amaterial layer formed on the wire layer and comprising a secondinsulating layer or an adhesive layer; a plurality of layer pairs formedon the material layer and configured to raise interference-proofing,water-proofing and optical performance, wherein the layer pairs areformed on the material layer in sequence, and each of the layer pairscomprises a third electrode layer and a third insulating layer formed insequence from a side adjacent to the material layer to another side awayfrom the material layer; and another third electrode layer formed on thelayer pairs, wherein the first direction is orthogonal to the seconddirection, the first electrodes and the second electrodes are configuredto sense capacitance variation in respond to a conductor indirectlytouching at least one of the first electrodes and the second electrodes.2. The touch sensing device as claimed in claim 1, further comprisingthe conductor, wherein the first electrodes and the second electrodesare used to sense total capacitance variation according to the conductorindirectly touching at least one of the first electrodes and the secondelectrodes.
 3. The touch sensing device as claimed in claim 1, whereinwhen the third electrode layer formed on the material layer, thematerial layer is the second insulating layer.
 4. The touch sensingdevice as claimed in claim 3, wherein the second insulating layer, thelayer pairs and the another third electrode layers form an isolatinglayer.
 5. The touch sensing device as claimed in claim 4, wherein theisolating layer is located between the wire layer and the substrate. 6.The touch sensing device as claimed in claim 5, further comprising anadhesive layer formed on the substrate.
 7. The touch sensing device asclaimed in claim 6, wherein a display device is disposed directly on theadhesive layer of the touch sensing device.